PLA
Is silk PLA weaker, and why does it clog?
By SSS
Published . Updated .
- Nozzle210–240 °C(410–464 °F)
- Bed35–45 °C(95–113 °F)
- Speedup to 250 mm/s
- Dry55 °C · 8 h(131 °F)
- Density1.27 g/cm³
Nozzle, Bed, Speed, Drying. Source: Bambu Lab TDS · Last checked 15 October 2026
Ranked filaments
| Rank | Filament | Nozzle | Bed | Datasheet | Buy |
|---|---|---|---|---|---|
| 1 | Bambu Lab · PLA Silk+ | 210–240 °C410–464 °F | 35–45 °C95–113 °F | Datasheet | |
Catalog nozzle and bed are empty. Technical data sheet V1.0 lists a nozzle of 210–240 °C (410–464 °F), a bed of 35–45 °C (95–113 °F), drying at 55 °C (131 °F) for 8 h, and a print speed under 250 mm/s. Z tensile strength is 25 ± 4 MPa. Z elongation is 1.5 ± 0.2 percent. X-Y elongation is 2.8 ± 0.6 percent. | |||||
| 2 | Bambu Lab · PLA Basic | 190–230 °C374–446 °F | 35–45 °C95–113 °F | Datasheet | |
Technical data sheet nozzle 190–230 °C (374–446 °F) and bed 35–45 °C (95–113 °F), with a print speed under 300 mm/s. Z tensile strength is 31 ± 3 MPa. Z elongation is 7.5 ± 1.3 percent. X-Y elongation is 12.2 ± 1.8 percent. Bambu says the specimen numbers are for comparison, not a guarantee on a finished part. | |||||
| 3 | Polymaker · Silk PLA | 190–230 °C374–446 °F | 50–70 °C122–158 °F | — | |
Catalog nozzle 190–230 °C (374–446 °F) and bed 50–70 °C (122–158 °F), Open Filament Database. No tensile strength is stored, so the Silk+ megapascals are not copied onto this row. The 210–240 °C (410–464 °F) band belongs to Silk+ only. | |||||
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On the one pair of sheets that publish both numbers, Bambu PLA Silk+ is weaker between layers than Bambu PLA Basic. That is not a result for every silk filament. The sheets also do not say why a silk spool clogs. Silk PLA, dual-color silk, clogs, and layer adhesion are the longer pages.
The only strength pair in the catalog
Bambu PLA Silk+ leaves nozzle and bed empty in the catalog. Technical data sheet V1.0 lists a nozzle of 210–240 °C (410–464 °F), a bed of 35–45 °C (95–113 °F), and a speed under 250 mm/s. Z tensile strength, the pull that separates layers, is 25 ± 4 MPa. Z elongation is 1.5 ± 0.2 percent. Elongation across the layers, X-Y, is 2.8 ± 0.6 percent.
Bambu PLA Basic lists 190–230 °C (374–446 °F), a bed of 35–45 °C (95–113 °F), and a speed under 300 mm/s. Z tensile strength is 31 ± 3 MPa. Z elongation is 7.5 ± 1.3 percent. X-Y elongation is 12.2 ± 1.8 percent. Bambu says those specimen numbers are for comparison, not a guarantee on your part. The Silk+ introduction still describes strength and toughness. The table and the introduction disagree. The table is the comparison used here.
Polymaker Silk PLA stores 190–230 °C (374–446 °F) and a bed of 50–70 °C (122–158 °F) from the Open Filament Database, and no strength table. The Silk+ megapascals stay on Silk+.
A comment says silk generally runs about 10 degrees hotter than normal PLA. Silk+ starts at 210 °C (410 °F) and PLA Basic starts at 190 °C (374 °F). Polymaker silk stores 190–230 °C (374–446 °F). The comment is not a setpoint for all three.
What the community says
a Reddit thread in r/FixMyPrint says silk PLA generally has to be printed about 10 degrees hotter than normal PLA, and asks what temperature the poster is using.
a Reddit thread in r/3Dprinting says layer adhesion with silk PLA is really bad, that it depends on brand and color, and that a structural part should use something else.
a Reddit thread in r/3Dprinting says there is little difference, that variation across PLA types is larger than silk versus normal, and that breaking between layers usually means the print was too cold.
Pros and cons
Pros
- The strength comparison is two tables from one company, with the test direction named.
- Polymaker silk stays on its own temperature band, without borrowed megapascals.
Cons
- Silk+'s introduction talks about strength and toughness. The specimen table is lower than PLA Basic. The marketing line and the table disagree.
- Two comments disagree on layer adhesion. One calls it really bad. One calls the difference small and blames a cold nozzle. Neither comment is a datasheet.
Printer considerations
- A megapascal is the stress on the test bar. Z is the direction that pulls layers apart. A lower Z number is the weaker layer bond on that sheet, for that pair of filaments only.
- Silk+ also lists a lower speed cap, under 250 mm/s against under 300 mm/s on PLA Basic, and a nozzle that starts at 210 °C (410 °F) instead of 190 °C (374 °F). [Silk PLA](/answers/silk) is the longer page. [Two-color silk](/answers/dual_color_silk) is the color variant. [Clogs](/answers/clog) and [layer adhesion](/answers/layer_adh) are the failure pages.
- Polymaker Silk PLA stores 190–230 °C (374–446 °F). A comment that silk should run about 10 degrees hotter is a comment. It is not this row's nozzle.
Sources & notes
Published . Updated .
Related questions
- Are dual/tri-color silk filaments worth it?PLA
- How do I print silk PLA, and is it weaker?PLA
- How do I improve layer adhesion?Strength
- Why does my nozzle keep clogging?Troubleshooting
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Questions
Are all silk PLAs weaker than plain PLA?
Only the Bambu pair is documented here. Silk+ Z tensile strength is 25 ± 4 MPa against 31 ± 3 MPa for PLA Basic, and Z elongation is 1.5 ± 0.2 percent against 7.5 ± 1.3 percent. Polymaker Silk PLA has no such table in the catalog. Silk, dual-color silk, clogs, and layer adhesion are the related pages.
Why does silk clog?
The Silk+ and PLA Basic sheets do not give a clog cause. They do show a slower speed cap on Silk+ and a nozzle band that starts 20 degrees higher at the bottom. A comment says to go about 10 degrees hotter. Another says interlayer breaks mean the nozzle was too cold. Those are comments, and they do not match each other exactly.