SUNLU PLA Lightweight (Lw-PLA) on the Bambu Lab H2S
Published . Updated .
Print settings and compatibility for SUNLU PLA Lightweight (Lw-PLA) on the Bambu Lab H2S, copied from the maker's data.
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What to set
Set your slicer to
- Nozzle: 180–200 °C (356–392 °F).
- Bed: 50–60 °C (122–140 °F).
- Print speed: 30–100 mm/s.
The maker did not list an enclosure or a hardened nozzle.
Will it work on this printer?
- H2S maximums: nozzle 350 °C (662 °F), bed 120 °C (248 °F).
- The listed nozzle temperature is within this printer's reach.
- The listed bed temperature is within this printer's reach.
- Whether an enclosure is required is not listed by the maker.
- A hardened nozzle is not listed by the maker.
Related
Where these numbers come from
Filament: SUNLU product page · checked 24 October 2026
Printer: H2S technical specifications · checked 15 October 2026
SUNLU PLA Lightweight (LW-PLA) (PLA) lists a nozzle temperature of 180–200 °C (356–392 °F) and a bed temperature of 50–60 °C (122–140 °F), and print speed 30–100 mm/s, from the SUNLU product page (https://store.sunlu.com/products/sunlu-pla-lightweight-lwpla-3d-printer-filament-0-8kg), checked 2026-10-24. The spool is 0.8 kg. Drying is not stated on that page.
A figure is copied from a named source, and a missing figure stays blank. Methodology.
The H2S technical specifications list a hardened steel nozzle, a 350 °C (662 °F) maximum nozzle temperature, and a 120 °C (248 °F) maximum heatbed temperature.
The product page describes a front door, a top cover, and enclosure alignment, and it says PLA and PETG can be printed without opening the door.
The specification lists active chamber heating to 65 °C (149 °F). Filament odometry is supported with AMS. The page does not say an AMS unit is included, and it does not name the extruder direct drive.